Hobit
01-27-2002, 04:36 PM
Fellow Forum Geeks
Have you seen this???
WOW! Ten percent of silicon based technology - article's characterization as hugely disruptive technology would be at best be a gross understatement.
Intel preps plastic memory production plan [Posted By Ashleigh Rawlings]
Intel Corp is accelerating the development of polymer-based memory and preparing to move into production with an alternative to flash memory that will be 10% of the price of its silicon equivalent and has vastly greater storage potential.
It is taking out production licenses for what are described as "possible Intel products" in a move that will send shivers down the spine of those with billions invested in silicon-based storage technology.
Under a new deal with Thin Film Electronics ASA (TFE), the two companies will begin development of fabrication processes for polymer memory modules at one of Intel's wafer fabrication facilities at Hillsboro, Oregon. Until now, the companies had been working together at TFE's R&D center in Lonkoping, Sweden, but the shift to Intel's home patch is an indication that the chip giant is expecting to move into production soon.
Plastic memory has the potential to be a hugely disruptive technology offering a full 3D architecture with the ability to stack thousands of the polymer layers. TFE also claims it can be produced as easily as printing color photographs.
hobit
Have you seen this???
WOW! Ten percent of silicon based technology - article's characterization as hugely disruptive technology would be at best be a gross understatement.
Intel preps plastic memory production plan [Posted By Ashleigh Rawlings]
Intel Corp is accelerating the development of polymer-based memory and preparing to move into production with an alternative to flash memory that will be 10% of the price of its silicon equivalent and has vastly greater storage potential.
It is taking out production licenses for what are described as "possible Intel products" in a move that will send shivers down the spine of those with billions invested in silicon-based storage technology.
Under a new deal with Thin Film Electronics ASA (TFE), the two companies will begin development of fabrication processes for polymer memory modules at one of Intel's wafer fabrication facilities at Hillsboro, Oregon. Until now, the companies had been working together at TFE's R&D center in Lonkoping, Sweden, but the shift to Intel's home patch is an indication that the chip giant is expecting to move into production soon.
Plastic memory has the potential to be a hugely disruptive technology offering a full 3D architecture with the ability to stack thousands of the polymer layers. TFE also claims it can be produced as easily as printing color photographs.
hobit