could i drop in a notebook cpu into a pc mobo?

[alfroogy]

Hi folks

My baby bros cpu is really dated and as my college just gave me a new notebook to work on when i start this coming semester, I was wondering if it's possible to drop my old notebooks cpu into his mobo.

He has a asus p5k se which is backwards compatible all the way to p4.
my notebook cpu is a core 2 t5600 1.83ghz.

all his other gear is ok he just got over ambitious and ran out of cash before he finished upgrading.

[mjc]

Probably not...notebook CPUs are often a different physical size/pin configuration.

[alfroogy]

Thanks man i suspected as much, just thought i'd make sure though.

[rond36]

No, a Core 2 Duo T5600 processor will not work on a desktop board!!!

The Asus P5K SE has a LGA775 (Land Grid Array 775) ZIF socket.
The Laptop will have a Micro-FCPGA 478 processor in a ZIF socket or a Micro-FCBGA 479 processor soldered directly to the motherboard.

http://www.intel.com/products/i/products/core2duo.jpghttp://www.intel.com/products/i/products/core2duo_mobile.jpg
Desktop LGA775............................................ ......Mobile micro-FCPGA

The Core 2 Duo T5600 processor comes in two models Micro-FCPGA and Micro-FCBGA neither model is compatible with a socket LGA775 motherboard.

The micro-FCPGA (Flip Chip Plastic Grid Array) package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. The package uses 478 pins, which are 2.03 mm long and .32 mm in diameter. While there are several micro-FCPGA socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the processor. Different from micro-PGA, the micro-FCPGA does not have an interposer and it includes capacitors on the bottom side.
http://www.intel.com/support/processors/procid/pix/FCPGATop.jpghttp://www.intel.com/support/processors/procid/pix/FCPGABottom.jpg


Micro-FCBGA (Flip Chip Ball Grid Array) package for surface mount boards consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use small balls, which acts as contacts for the processor. The advantage of using balls instead of pins is that there are no leads that bend. The package uses 479 balls, which are .78 mm in diameter. Different from Micro-PGA, the micro-FCPGA includes capacitors on the top side.
http://www.intel.com/support/processors/procid/pix/FCBGATop.jpghttp://www.intel.com/support/processors/procid/pix/FCBGABottom.jpg
These processors are soldered onto the motherboard much like the north and south bridge chips and can not be removed!!!

I learned something new while researching your question.
I had always thought the "P" in Micro-FCPGA stood for Pin, not plastic.
Flip Chip Pin Grid Array, not Flip Chip Plastic Grid Array