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ASRock gears up for Ryzen 9000 with promising new BIOS update for AM5 motherboards

ASRock BIOS update for X670E
Last Updated on July 3, 2024
AMD Ryzen 9000 series promotional graphic
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The stage is being set for the arrival of AMD’s highly anticipated Ryzen 9000 “Zen 5” desktop processors. Motherboard manufacturers are scrambling to ensure compatibility and optimal performance for these next-generation CPUs, and ASRock is the latest to join the fray. Following similar moves by MSI and ASUS, ASRock has released an updated BIOS firmware based on AMD’s AGESA microcode for its AM5 motherboards.

Currently, the update is only available for ASRock’s flagship X670E Taichi motherboard. This flagship offering receives the 3.04.AS01 (BETA) BIOS version, bringing with it – according to the update description – improved support for the upcoming Ryzen 9000 CPUs. While specific details are limited, the increased file size compared to the previous BIOS suggests significant changes.

ASRock BIOS – Image Source: ASRock

More stability for X670E

Industry insiders believe the AGESA BIOS represents the most stable version available before the official Ryzen 9000 launch. This makes it a critical update for users with AM5 motherboards based on the X670E, X670, B650E, B650, or A620 chipsets. Updating to this BIOS version will ensure optimal performance and stability when paired with the new Ryzen 9000 CPUs, which will be available this month – slated for the end of July.

X870E and X870 motherboards also on the way

Looking beyond the immediate AM5 lineup, ASRock is also preparing for the future with its next-generation X870E and X870 motherboards. These motherboards were unveiled at Computex 2024, and they boast full compatibility with the Ryzen 9000 processors. Their launch is expected in late September, potentially aligning with the release of the Ryzen 9000 X3D variant.

The upcoming X870E and X870 motherboards come in a variety of popular ASRock designs, including Taichi, Nova, Riptide, Steel Legend, and PRO. These next-gen boards promise to deliver significant improvements in several key areas. Users can expect enhanced I/O capabilities, faster memory support, and robust power delivery systems.

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