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New Intel and AMD motherboards leaked as EEC filing reveals upcoming products from Maxsun

New AMD and Intel motherboards ready to go?
Last Updated on May 30, 2024
New Intel and AMD motherboards leaked as EEC filing reveals upcoming products from Maxsun
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In a move that sheds some light on upcoming PC components, motherboard manufacturer Maxsun has submitted filings to the Eurasian Economic Commission (EEC) revealing next-generation motherboard models for both Intel and AMD. This early leak provides clues for consumers looking to upgrade their PCs shortly. Let’s see what products are worth noting and what this means for the current generations in the marketplace.

Intel chipsets

The filings detail Intel 800-series motherboards including the Z890, B860, and H810 chipsets. These chipsets are expected to be compatible with Intel’s upcoming Arrow Lake CPUs, codenamed Core Ultra 200. The LGA 1851 socket on these motherboards will mark a shift from previous generations, requiring users to upgrade their CPU coolers alongside the motherboard and CPU itself.

This information is sure to be valuable for PC builders aiming for high-end performance or those planning a complete system overhaul. Arrow Lake CPUs are expected to be released in Q4 of 2024, with a launch date expected to be revealed at Innovation 2024, which recently had its dates announced.

New Maxsun EEC Filing – Image Source: EEC

AMD chipsets

The filings also hint at upcoming AMD offerings. Maxsun included B850 and B840 motherboards, which don’t follow the typical naming scheme for Intel chipsets. However, this aligns with recent reports suggesting AMD is transitioning its motherboard PCH branding from the 700-series to the 800-series – a move that aligns them numerically with Intel. These B-series motherboards likely represent the successors of the current B650 series and could potentially signify a new naming scheme for future AMD chipsets, so it looks like a good time to be a fan of Team Red.

In contrast to Intel, AMD’s 800-series motherboards offer broader compatibility. They’ll work with current Ryzen 7000 CPUs, upcoming Ryzen 8000 and Ryzen 9000 processors, and even future Zen 5 architecture CPUs – all on the same AM5 platform. This gives AMD users a wider range of upgrade options within the same motherboard socket.

Full list of products

Below you will find a full list of products mentioned in the Maxsun EEC filing:

  • MS-iCraft Z890 VERTEX
  • MS-iCraft Z890 ARCTIC
  • MS-iCraft Z890 PACIFIC
  • MS-Terminator Z890-A
  • MS-iCraft Z890ITX
  • MS-ESPORT Z890M WIFI
  • MS-Challenger Z890M WIFI
  • MS-iCraft B860M CROSS
  • MS-Terminator B860M
  • MS-Terminator B860M GKD
  • MS-ESPORT B860M SNIPER WIFI
  • MS-ESPORT B860M GANK WIFI
  • MS-ESPORT B860M ACE WIFI
  • MS-Challenger B860M-E
  • MS-Challenger B860M-F
  • MS-Challenger B860M
  • MS-MILESTONE B860M
  • MS-Challenger B860ITX
  • MS-Challenger B860BKB
  • MS-Terminator B860YTX
  • MS-Terminator B860ITX
  • MS-ESPORT H810M GANK WIFI
  • MS-Challenger H810M
  • MS-Challenger H810M-K
  • MS-Challenger H810M-F
  • MS-Challenger H810M-D
  • S-Terminator B850M WIFI
  • MS-Esports B850M WIFI6 ICE
  • MS-Terminator B850ITX WIFI
  • MS-Challenger B850M WIFI ICE
  • MS-Challenger B840M 2.5G

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