AMD fans are currently looking forward to the Ryzen 9000X3D CPUs. One of them, the 9800X3D, is expected to launch in the first week of November. As we’re getting closer to the release date, we’re seeing new leaks popping up, giving us an idea about what the upcoming series might offer. And according to a recent leak, the 9000X3D CPUs could bring a new approach to thermal management, potentially offering cooler performance and efficiency gains compared to previous X3D models.

9000X3D CPUs might offer a rearranged 3D V-Cache design

According to VideoCardz, who managed to get their hands on some leaked information, AMD plans to offer next-generation 3D V-Cache in the upcoming 9000X3D CPUs and better thermal performance. As per HXL on X, the company is basically doing this by rearranging the order of the 3D V-Cache on each chiplet. Rather than placing the 3D V-Cache above each CCD, AMD will now position the CCD over the V-Cache. In short, the roles have been reversed, and this would allow AMD to get the core complex closer to the IHS.

This design change could allow for more efficient heat transfer, enabling the processor to dissipate heat more effectively. This would be especially valuable in high-performance, sustained workloads where overheating can lead to throttling or, worse, damaging the CPU. If the rumored redesign turns out to be true, users might see Ryzen 9000X3D CPUs run cooler while maintaining high clock speeds under load.

The Ryzen 9000X3D CPUs are expected to hit the market on November 7, 2024. Currently, the only confirmed model is the Ryzen 7 9800X3D, though it's unclear which other processors will join the launch lineup. Recent Geekbench benchmark leaks suggest that the 9800X3D outperforms its predecessor, the 7800X3D, by around 20%.

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Abdul Haddi

Abdul is a tech writer and Editor for PC Guide, specializing in all things tech, gaming, and hardware.