Intel’s upcoming LGA1851 socket designed for Arrow Lake processors might finally address the thermal throttling issues that have plagued recent generations. According to hardware leaker Jaykihn, the LGA1851 socket will offer two distinct loading mechanisms (ILMs). Firstly, a standard one similar to LGA1700, and a brand new “Reduced Load ILM” (RL-ILM) specifically targeted at enthusiasts seeking superior cooling performance.
In case you missed it, the new LGA1851 socket is all but officially confirmed for 15th Gen Arrow Lake CPUs, though DDR4 support is likely to be dropped. On the bright side, overclockers trying to get the best out of their system will benefit from this newer design.
ILM and CPU cooling
For those unfamiliar, the ILM plays a crucial role in CPU cooling. It’s the mechanism that secures the CPU in the motherboard socket and ensures proper contact with the CPU cooler. Unfortunately, the LGA1700 socket, used for Alder Lake, Raptor Lake, and Raptor Lake Refresh CPUs (12th to 14th gen) has been a source of frustration for overclockers due to its flawed ILM design.
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The previous design exerted excessive pressure on the center of the CPU, causing it to bend slightly over time, in some cases. This bending disrupts the contact between the CPU and the cooler, leading to higher temperatures – possibly leading to damage.
New RL-ILM design for LGA1851 is optional
The new RL-ILM appears to be an optional upgrade that motherboard manufacturers can choose to implement. The estimated cost difference between the standard and RL-ILM is just $1 (yes, you read that correctly), which should incentivize many manufacturers to adopt the higher-performing option for mid-range and high-end motherboards.
While the exact specifications of the RL-ILM remain a mystery for now, its core purpose is evident. That being improved thermal performance. This undoubtedly translates to a significantly altered design compared to the standard LGA1851 or LGA1700 ILMs.
Design changes for RL-ILM
To address this issue of bending from the old ILM, Intel is likely incorporating a less aggressive design for the RL-ILM. This new design would distribute the contact points across a broader surface area of the CPU’s integrated heat spreader (IHS), minimizing the risk of bending. If these rumors hold true, the RL-ILM represents a significant improvement for the LGA1851 socket.
It’s important to remember that this information is based on leaks and not official confirmation from Intel. However, if the rumors prove accurate, the LGA1851 socket with the optional RL-ILM could be a game-changer for enthusiasts and a positive step forward for overall thermal management in future Intel processors.
